Materials companies
105 companies in the Materials part of the semiconductor & AI value chain — Materials are the physical feedstocks — silicon wafers, photoresists, specialty gases, substrates, and chemicals — that every fabrication process consumes. Without ultra-pure materials meeting atomic-level tolerances, even the most advanced equipment cannot produce working chips. The segment is characterized by highly concentrated supply: Japan holds dominant positions in silicon wafers (Shin-Etsu leads; Sumco is a major supplier), photoresists (JSR, TOK, Shin-Etsu), and photomask blanks (HOYA), while the US and Germany hold key positions in specialty gases and CMP consumables.
Subsegments
Market share
Companies
- Ajinomoto — Supplies effectively all ABF build-up film, the insulator in advanced CPU/GPU substrates.
- Linde — World's largest industrial gas company; major electronics gas business.
- Corning Incorporated — Optical fiber, cable, and glass materials maker; top global producer of optical fiber for AI data center interconnect and a first-mover in glass-core substrates for advanced chip packaging.
- Air Liquide — Top industrial and electronic specialty gas supplier to fabs worldwide.
- Shin-Etsu Chemical — World's largest silicon wafer maker and a major photoresist supplier.
- HOYA — Dominant maker of EUV photomask blanks and substrates.
- Unimicron — Largest Taiwanese ABF substrate maker serving major fabless customers.
- Ibiden — Leading IC package substrate maker; key supplier for Intel and AI packages.
- Entegris — Leader in contamination control, materials handling and CMP consumables.
- JX Advanced Metals — World leader in sputtering targets for chip metallization; listed in 2025.
- Ningbo Jiangfeng Electronic Material (Konfoong) — China's leading maker of ultra-high-purity sputtering targets (Al, Ti, Ta) for semiconductor metallization.
- Tokyo Ohka Kogyo — Photoresist specialist with leading EUV resist share.
- Soitec — Dominant supplier of engineered SOI substrates for RF and FD-SOI chips.
- Mitsui Chemicals, Inc. — First commercial EUV pellicle manufacturer (ASML license); developing CNT pellicles for High-NA EUV.
- Photronics — Largest merchant photomask manufacturer.
- Fujimi Incorporated — Specialist leader in CMP slurries and polishing materials.
- Mitsui High-tec — Leading leadframe maker and precision stamping specialist.
- Stella Chemifa — World's leading maker of high-purity hydrofluoric acid for semiconductors.
- IQE — Leading epitaxial compound-semiconductor wafer maker (GaAs, GaN, InP).
- JSR — Top photoresist maker incl. EUV resists; taken private by JIC in 2024.
- SK Specialty — Korean specialty-gas maker and a top global NF3 supplier.
- Merck KGaA (EMD Electronics) — Supplies deposition materials, spin-on dielectrics and specialty gases.
- Air Products — Major supplier of bulk and specialty gases to semiconductor fabs.
- Shengyi Technology — Copper-clad laminates and substrate materials for PCBs.
- BASF SE — German chemicals major; supplies CMP slurries (PLANAPUR), post-CMP cleaning chemistries, and electronic-grade wet chemicals for wafer fabrication.
- Shennan Circuits — Chinese PCB and IC substrate maker.
- Daikin Industries — Fluorochemicals maker supplying etch gases and coatings alongside HVAC.
- Kyocera — Ceramic packages, substrates, and electronic components.
- Nan Ya PCB — Formosa-group package substrate and PCB maker.
- FUJIFILM — Electronic materials arm supplies resists, CMP slurries and chemicals.
- Resonac — Formed from Showa Denko and Hitachi Chemical; broad back-end materials line.
- DuPont — Broad electronic materials supplier; electronics unit being spun off as Qnity.
- Furukawa Electric — Optical fiber, components, and electronic materials maker.
- Nippon Sanso Holdings — Japanese industrial gas group with strong electronics gas share in Asia.
- Sumitomo Metal Mining — Materials maker supplying bonding wire, plating, and target metals.
- Zhen Ding Technology — World's largest PCB maker; flexible and IC substrate supplier to Apple.
- Nitto Denko Corporation — Japanese materials group; supplies semiconductor wafer dicing tape and back-grinding tape.
- Kinsus Interconnect — Pegatron-affiliated IC substrate manufacturer.
- GlobalWafers — Third-largest silicon wafer maker; expanding US capacity in Texas.
- TTM Technologies — North America's largest PCB maker; RF and substrate components.
- Toray Industries — Japanese materials group; supplies PHOTONEECE photosensitive polyimide used for passivation and dielectric layers in semiconductor packaging.
- Mitsubishi Chemical Group — Diversified chemicals; electronic materials, polishing slurries, and films.
- LG Innotek — LG affiliate making IC substrates, camera modules, and components.
- Avantor — Materials and services supplier of ultrapure process chemicals to fabs.
- Element Solutions — Specialty chemicals for electronics assembly and advanced packaging.
- Dai Nippon Printing — Top-tier photomask producer alongside its printing businesses.
- TOPPAN Holdings — Major merchant photomask maker within diversified printing group.
- SUMCO — Second-largest silicon wafer producer, supplying all leading fabs.
- AGC Inc. — Glass and chemicals maker; leading EUV photomask blanks and fluorinated gases.
- AT&S — Austrian high-end IC substrate and PCB maker expanding advanced packaging.
- Umicore — Belgian materials group supplying sputtering targets, evaporation materials, and copper electroplating chemistries for advanced packaging and semiconductor front-end processes.
- Kingboard Holdings — Major maker of copper-clad laminates and PCB materials.
- Nissan Chemical — Specialty chemicals maker; anti-reflective and spin-on materials for fabs.
- Jiangsu Nata Opto-electronic Material (Nanda Optoelectronics) — Suzhou maker of MO sources, ALD/CVD precursors, electronic specialty gases and ArF photoresist materials.
- Materion — Advanced materials maker supplying targets and precious-metal products.
- Sumitomo Chemical — Diversified chemicals group with significant photoresist business.
- Wacker Chemie — Major polysilicon and silicone maker supplying semiconductor-grade silicon.
- Tosoh — Supplies sputtering targets and quartzware for fabs.
- Mitsubishi Gas Chemical — Cleaning chemicals and BT substrate resin maker.
- Mitsubishi Materials — Advanced materials; bonding wire, cemented carbide, and low-alpha solder/plating chemicals (exited sputtering targets, complete March 2024).
- Iwatani — Industrial and electronic specialty-gas supplier.
- Solvay — Specialty chemicals group supplying high-purity electronic materials.
- Siltronic — Top-four silicon wafer producer headquartered in Munich.
- Nippon Electric Glass — Japanese glass maker; supplies through-glass-via (TGV) glass core substrates for advanced chip packaging and image sensor cover glass.
- Suzhou Crystal Clear Chemical (Jingrui) — Suzhou maker of ultra-high-purity wet chemicals/reagents and photoresist for IC and display manufacturing.
- Chang Wah Technology — Leadframe and semiconductor packaging materials maker.
- Hansol Chemical — Korean precursor and process-chemical supplier to memory and logic fabs.
- Tokuyama — Japanese chemical maker; semiconductor-grade polysilicon and fumed silica.
- Soulbrain — Korea's leading process-chemical and etchant maker, including high-purity HF.
- Dongjin Semichem — Korean photoresist and process-chemical maker supplying Samsung and SK hynix.
- Wonik Materials — Korean specialty-gas and precursor supplier for chip fabs.
- Ohara Inc. — Japanese optical and electronic glass maker; supplies low-expansion glass-ceramics and quartz glass for semiconductor exposure equipment and photomask substrates.
- Simmtech — Korean maker of semiconductor substrates and memory-module PCBs.
- Heraeus — Family-owned precious metals group supplying targets and bonding wire.
- Samsung Electro-Mechanics — Samsung affiliate making IC substrates, MLCCs, and camera modules.
- SCHOTT AG — German specialty glass maker owned by the Carl Zeiss Foundation; supplies fused quartz for etch/epitaxy/diffusion equipment, photomask blank glass, and photostructurable FOTURAN glass wafers.
- Shinko Electric Industries — Package substrate and leadframe maker; taken private by JIC and delisted from TSE in June 2025.
- SK Siltron — SK Group's wafer arm; key 300mm supplier to Korean memory fabs.
- Tanaka Precious Metals — Precious-metals group supplying bonding wire, plating, and targets.
- TanKeBlue Semiconductor — Beijing pioneer of China's SiC substrate industry; a leading SiC monocrystalline substrate supplier.
- National Silicon Industry Group — China's largest 300mm silicon wafer maker (Zing Semiconductor).
- Arkema — French specialty chemicals group supplying plasma-etch gases (Foranext), ALD/CVD alkylamines, and polyimides for semiconductor and flexible-circuit manufacturing.
- Wolfspeed — SiC wafer and device pure-play; restructured through Chapter 11 in 2025.
- Albemarle Corporation — Lithium and specialty chemicals producer; supplies anhydrous hydrogen bromide for semiconductor plasma etching and butyllithium as an electronic-grade intermediate.
- ITEQ — Copper-clad laminate and prepreg maker for high-speed PCBs.
- Sumitomo Bakelite — Semiconductor encapsulation resins and packaging materials.
- Daeduck Electronics — Korean PCB and IC-substrate manufacturer.
- Nagase & Co. — Chemicals trading house and electronic-materials maker.
- Ferrotec — Supplies vacuum feedthroughs, ceramics and materials to equipment makers.
- Adeka — Chemicals maker supplying high-k/ALD precursors and additives.
- Solar Applied Materials — Taiwanese sputtering target and precious-metal recycling specialist.
- Wafer Works — Taiwanese silicon wafer maker focused on prime and reclaim wafers.
- Kanto Denka Kogyo — Specialty fluorine gas and etchant chemical maker.
- Foosung — Korean fluorine chemicals and specialty-gas maker.
- Haesung DS — Korean leadframe and package-substrate maker.
- Taiwan Mask Corporation — Taiwanese merchant photomask maker.
- MK Electron — Korean bonding-wire and solder-materials maker.
- Atomera — Materials-engineering technology (MST) licensed to chipmakers.
- DNF — Korean maker of CVD/ALD precursors and thin-film materials.
- Absolics Inc. — SKC subsidiary building a first-of-its-kind glass core substrate mass-production fab in Covington, Georgia.
- Brewer Science — Specialty spin-on and temporary-bonding materials for advanced packaging.
- Doosan Electro-Materials — Korean copper-clad laminate and IC-substrate materials maker.
- SemiQ Inc. — Lake Forest, CA maker of SiC power semiconductors and 150mm SiC epitaxial wafers for high-voltage uses.
- SK Enpulse — SK affiliate; divested CMP pads to Hahn & Co. and blank photomasks to Fusion New Material in 2025; absorbed into parent SKC via merger effective 2025-12-23, ceasing as an operating company.
- UP Chemical — Korean maker of CVD/ALD precursors for chip fabrication.
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