Sumitomo Metal Mining

About Sumitomo Metal Mining

Sumitomo Metal Mining, headquartered in Japan, operates in the Packaging Materials (Leadframes, Bonding Wire) and Sputtering Targets segments of the semiconductor & AI supply chain and is positioned as a market major there. Its key products include Gold and copper bonding wire for IC packaging, Sputtering targets (Ni, Co, Cu, precious metals), Electroless nickel plating materials, High-purity metals and alloys for electronics, Lithium nickel oxide cathode materials for batteries. wafergraph maps 9 tracked customers for Sumitomo Metal Mining across the value chain. It has a supply-chain criticality score of 68/100, with 236 companies downstream of it.

Key products

• Gold and copper bonding wire for IC packaging
• Sputtering targets (Ni, Co, Cu, precious metals)
• Electroless nickel plating materials
• High-purity metals and alloys for electronics
• Lithium nickel oxide cathode materials for batteries

Customers

• ASE Technology
• Amkor Technology
• TSMC
• Samsung Electronics
• Intel
• SK hynix
• Micron Technology
• SMIC
• GlobalFoundries

More Materials companies

• Ajinomoto
• Linde
• Corning Incorporated
• Air Liquide
• Shin-Etsu Chemical
• HOYA
• Unimicron
• Ibiden
• Entegris
• JX Advanced Metals
• Ningbo Jiangfeng Electronic Material (Konfoong)
• Tokyo Ohka Kogyo

Compare with

Kyocera · JX Advanced Metals · Ningbo Jiangfeng Electronic Material (Konfoong) · Element Solutions · Materion · Tosoh