Nitto Denko Corporation
Nitto Denko Corporation is a major in the Materials segment of the semiconductor & AI supply chain, headquartered in Japan.
Japanese materials group; supplies semiconductor wafer dicing tape and back-grinding tape.
- Ticker
- TSE: 6988
- Headquarters
- Japan
- Revenue
- $6.5B (FY2026) · +1.4% YoY
- Net income
- $840M
- Operating margin
- 18.1%
- Market position
- major
- Value-chain segment
- Packaging Materials (Leadframes, Bonding Wire)
- Key products
- Semiconductor wafer dicing tape, Back-grinding tape
About Nitto Denko Corporation
Nitto Denko Corporation, headquartered in Japan, operates in the Packaging Materials (Leadframes, Bonding Wire) segment of the semiconductor & AI supply chain and is positioned as a market major there. Its key products include Semiconductor wafer dicing tape, Back-grinding tape.
Key products
- Semiconductor wafer dicing tape
- Back-grinding tape
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Sources
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