Deposition companies
17 companies in the Deposition part of the semiconductor & AI value chain.
Companies
- Applied Materials — Broadest wafer fab equipment maker, leading in deposition and implant.
- Lam Research — Etch leader, critical to 3D NAND and advanced logic patterning.
- Tokyo Electron — Japan's biggest fab equipment maker; near-monopoly in coater/developers.
- ASM International — Leader in atomic layer deposition (ALD) and epitaxy tools.
- AIXTRON — Leading MOCVD equipment maker for SiC, GaN and LED production.
- HPSP — Near-monopoly maker of high-pressure hydrogen annealing equipment.
- Kokusai Electric — Specialist in batch thermal deposition furnaces for memory and logic.
- Jusung Engineering — Korean ALD, CVD, and epitaxy equipment maker.
- Wonik IPS — Korean deposition and thermal-process equipment maker for memory fabs.
- ULVAC — Vacuum equipment maker; sputtering and deposition systems for semis.
- NAURA Technology — China's largest domestic fab equipment maker across etch and deposition.
- Piotech — Chinese thin-film deposition (PECVD and ALD) equipment maker.
- Veeco Instruments — Deposition specialist: laser annealing, MBE, ion beam and MOCVD.
- Oxford Instruments — Plasma etch and deposition tools for compound semis and research.
- Eugene Technology — Korean LPCVD and ALD deposition equipment specialist.
- ClassOne Technology — Wet-processing and electroplating tools for 200mm and specialty fabs.
- Evatec — Swiss thin-film deposition (PVD) systems for packaging and photonics.
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