Assembly & Packaging Equipment companies

Companies

• DISCO — Controls most of the market for wafer dicing and grinding equipment. leader · TSE:6146 · $2.7B rev · Japan
• ASMPT — Largest back-end assembly and packaging equipment maker; TCB leader. leader · HKEX:0522 · $1.8B rev · Singapore
• TOWA — Leader in semiconductor molding/encapsulation equipment. leader · TSE:6315 · $342M rev · Japan
• Nordson — Dispensing, bonding inspection, and test systems for electronics and semis. major · NASDAQ:NDSN · $2.8B rev · United States
• Tokyo Seimitsu (Accretech) — Wafer dicing, grinding, and metrology equipment maker. major · TSE:7729 · $1.0B rev · Japan
• SUSS MicroTec — Packaging lithography, coaters and bonders for advanced packaging. major · FWB:SMHN · $581M rev · Germany
• SEMES — Samsung's in-house equipment arm; etch, cleaning, and packaging tools. major · South Korea