Rapidus–IBM 2nm partnership
As of 2026-10-09, Rapidus–IBM 2nm partnership is under construction, involving Rapidus, IBM. This status may change; this page reflects the wafergraph deals dataset as of 2026-10-09. Japan-backed Rapidus licensed IBM 2nm nanosheet tech for its Hokkaido fab, targeting ~2027.
Deal record from the wafergraph deals corpus · every field traces to the sources listed below · page data as of 2026-10-09
- Type
- foundry_deal
- Announced
- 2022-12-13
- Status
- under_construction
- Parties
- Rapidus (builder), IBM (partner)
- Source confidence
- high
The companies involved
Rapidus
Government-backed Japanese foundry targeting 2nm production in 2027. challenger in Pure-Play Foundry, headquartered in Japan. 2 tracked suppliers, 6 tracked customers
IBM
Enterprise computing and cloud; designs its own Power and Telum chips. major in Hyperscalers, headquartered in United States, market cap $213.5B. 6 tracked suppliers, 1 tracked customers · supply-chain risk
Sources
Frequently asked questions2
- When was Rapidus–IBM 2nm partnership announced?
- Rapidus–IBM 2nm partnership was announced on 2022-12-13 and is under_construction.
- Who were the parties in Rapidus–IBM 2nm partnership?
- Rapidus (builder), IBM (partner).
Cite as: wafergraph, “Rapidus–IBM 2nm partnership”, https://wafergraph.com/deal/rapidus_ibm/ (data as of 2026-10-09).
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