Chipbond Technology vs Unisem
Both are primarily Outsourced Assembly & Test companies. Chipbond Technology is larger by market cap ($5.3B vs $1.8B). Chipbond Technology reports higher tracked revenue ($675M vs $459M).
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Side-by-side
| Chipbond Technology | Unisem | |
|---|---|---|
| Market cap | $5.3B | $1.8B |
| Revenue | $675M (FY2025) | $459M (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | Malaysia |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 7 |
| Chokepoint / criticality | 68/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-10-09. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Unisem compare
- Size: Chipbond Technology is the larger company by market cap.
- Revenue: Chipbond Technology reports higher tracked revenue.
- Supply-chain criticality: Both companies have the same chokepoint score (68/100).
- Footprint: Chipbond Technology (Taiwan) vs Unisem (Malaysia).
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Cite as: wafergraph, “Chipbond Technology vs Unisem”, https://wafergraph.com/compare/chipbond-vs-unisem (data as of 2026-10-09).
Frequently asked questions3
- Is Chipbond Technology bigger than Unisem?
- Chipbond Technology is larger by market cap ($5.3B vs $1.8B).
- What's the difference between Chipbond Technology and Unisem?
- Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan; Unisem is a major in Outsourced Assembly & Test based in Malaysia. Both operate in the OSAT segment.
- Who are Chipbond Technology's and Unisem's suppliers?
- wafergraph tracks 0 suppliers for Chipbond Technology and 0 for Unisem.