Chipbond Technology vs King Yuan Electronics (KYEC)
King Yuan Electronics (KYEC) is larger by market cap ($10.3B vs $3.6B). King Yuan Electronics (KYEC) reports higher tracked revenue ($1.1B vs $666M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | King Yuan Electronics (KYEC) | |
|---|---|---|
| Market cap | $3.6B | $10.3B |
| Revenue | $666M (FY2025) | $1.1B (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | Taiwan |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 7 |
| Chokepoint / criticality | 68/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and King Yuan Electronics (KYEC) compare
- Size: King Yuan Electronics (KYEC) is the larger company by market cap.
- Revenue: King Yuan Electronics (KYEC) reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 68/100).
- Footprint: Chipbond Technology (Taiwan) vs King Yuan Electronics (KYEC) (Taiwan).
Company hubs
Chipbond Technology · King Yuan Electronics (KYEC) · OSAT segment