ASE Technology vs Chipbond Technology
Both are primarily Outsourced Assembly & Test companies. Chipbond Technology has a tracked market cap of $5.3B; ASE Technology is currently unpriced in the dataset. ASE Technology reports higher tracked revenue ($20.6B vs $675M).
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Side-by-side
| ASE Technology | Chipbond Technology | |
|---|---|---|
| Market cap | Unpriced | $5.3B |
| Revenue | $20.6B (FY2025) | $675M (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | leader | major |
| Country | Taiwan | Taiwan |
| Tracked suppliers | 20 | 0 |
| Tracked customers | 72 | 9 |
| Chokepoint / criticality | 81/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-10-09. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How ASE Technology and Chipbond Technology compare
- Revenue: ASE Technology reports higher tracked revenue.
- Supply-chain criticality: ASE Technology has the higher chokepoint score (81/100 vs 68/100).
- Footprint: ASE Technology (Taiwan) vs Chipbond Technology (Taiwan).
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Cite as: wafergraph, “ASE Technology vs Chipbond Technology”, https://wafergraph.com/compare/ase-vs-chipbond (data as of 2026-10-09).
Frequently asked questions3
- Is ASE Technology bigger than Chipbond Technology?
- By tracked revenue, ASE Technology is larger ($20.6B vs $675M).
- What's the difference between ASE Technology and Chipbond Technology?
- ASE Technology is a leader in Outsourced Assembly & Test based in Taiwan; Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan. Both operate in the OSAT segment.
- Who are ASE Technology's and Chipbond Technology's suppliers?
- wafergraph tracks 20 suppliers for ASE Technology and 0 for Chipbond Technology — ASE Technology's include Tokyo Electron, Advantest, Teradyne.