This Week in the Chain — Aug 3, 2026

New companies added (50)

The map grew 565 to 615 this week — the biggest single expansion since launch. The gaps were structural: storage (Seagate, Western Digital), interconnect (Amphenol, TE Connectivity, Molex), contract manufacturing (Flex, Sanmina, Luxshare), twenty names across the AI-datacenter power and cooling chain, and Corning. Every addition went through an adversarial sourcing gate before it shipped — two staged supplier relationships were killed for being years dead.

1. 1AAONAI & Data Center
2. 2ABB LtdAI & Data Center
3. 3Albemarle CorporationMaterials
4. 4AmphenolAnalog, Power, RF
5. 5ArkemaMaterials
6. 6BASF SEMaterials
7. 7Benchmark ElectronicsDistribution & Misc
8. 8BizLink HoldingAnalog, Power, RF
9. 9Bloom EnergyAI & Data Center
10. 10CaterpillarAI & Data Center
11. 11Compal ElectronicsDistribution & Misc
12. 12Corning IncorporatedDistribution & Misc

Showing 12 of 50. Source: wafergraph dataset.

Coverage changes

Coverage, compared with Jul 27, 2026.

Source: wafergraph dataset. As of 2026-08-03.

Top gainers

1. 1Ambarella$2.8B → $3.7B+29.7%
2. 2Microsoft$2.89T → $3.62T+25.2%
3. 3Amazon (Annapurna Labs)$2.51T → $3.08T+22.8%
4. 4Aeva Technologies$1.0B → $1.2B+18.8%
5. 5Avantor$8.1B → $9.4B+16.2%
6. 6Advantest$125.5B → $145.5B+16.0%
7. 7Sumitomo Bakelite$3.6B → $4.1B+14.0%
8. 8Fuji Electric$11.6B → $13.2B+13.9%

Source: wafergraph live market caps (Yahoo Finance × SEC shares). As of 2026-08-03.

Top decliners

Market-cap moves versus Jul 27, 2026: 350 names at 1% or more. Live caps, not adjusted beyond price and share count.

1. 1Tongfu Microelectronics$17.2B → $11.6B-32.9%
2. 2JCET Group$21.8B → $16.2B-25.8%
3. 3Hangzhou Changchuan Technology$28.6B → $21.4B-25.3%
4. 4Kingsemi$10.4B → $7.8B-25.2%
5. 5Piotech$34.1B → $25.5B-25.1%
6. 6Wafer Works$2.1B → $1.6B-24.4%
7. 7Ningbo Jiangfeng Electronic Material (Konfoong)$9.8B → $7.6B-23.1%
8. 8Zhongke Feice Technology$20.3B → $15.7B-22.5%

Source: wafergraph live market caps. As of 2026-08-03.

US-listed gainers

Narrowed to stocks tradeable on a US exchange (NASDAQ/NYSE/OTC). A foreign company with a US-listed ADR, such as TSMC or ASML, counts; a foreign-exchange-only listing does not.

1. 1Ambarella$2.8B → $3.7B+29.7%
2. 2Microsoft$2.89T → $3.62T+25.2%
3. 3Amazon (Annapurna Labs)$2.51T → $3.08T+22.8%
4. 4Aeva Technologies$1.0B → $1.2B+18.8%
5. 5Avantor$8.1B → $9.4B+16.2%

Source: wafergraph live market caps (Yahoo Finance × SEC shares). As of 2026-08-03.

US-listed decliners

1. 1Amkor Technology$14.9B → $11.9B-20.3%
2. 2NXP Semiconductors$67.9B → $55.7B-18.0%
3. 3Qualcomm$177.6B → $152.2B-14.3%
4. 4KLA$263.7B → $229.2B-13.1%
5. 5Materion$5.0B → $4.3B-12.9%

Source: wafergraph live market caps. As of 2026-08-03.

Why it matters

Tongfu Microelectronics's segment: OSAT — Outsourced semiconductor assembly and test (OSAT) companies package finished dies into the chips and modules that go into end products. As advanced packaging — chiplets, CoWoS, HBM stacking, and fan-out technologies — moves from niche to mainstream, OSATs have become strategic partners rather than commodity handlers. ASE Technology (which includes SPIL) is the world's largest OSAT; Amkor is a major player in advanced packaging in the Americas and Korea. TSMC and Samsung also offer advanced packaging in-house, competing directly with OSATs at the leading edge.

Segment context from the wafergraph taxonomy.